NOK 0,00
(frakt: 0,00)
Thermal Grizzly TG-ILT-12G, Akryl, Gjennomsiktig, LGA 1700, CPU, Prosessor, 1 stykker
Varenr.: [8659606] | Producent: Thermal Grizzly | Model-nr.: TG-ILT-12G | EAN: 4260711990649
Fjernlager
Varen er på fjernlager, leveringstiden er 6-8 hverdager. Mere info
Leveringsalternativer - Velges i kassen
Instabox - Velg din nærmeste pakkeboks
59,00
Bring – Leveres til pakkeboks nær deg
59,00
Bring – Leveres på hentested nær deg
59,00
PorterBuddy - Fleksibel hjemlevering - levert på døren på kvelden
174,00
Bring - Fleksibel hjemlevering - Levering til døren (om kvelden i større byer)
199,00
Vis alle leveringsalternativer (5)
Fraktprisen er basert på levering til dette postnummer:0015 - OSLO Skift postnummer
Oppgi postnummer for levering.
NOK
319,00
eksklusiv MVA 255,20
Totalt inkl. frakt
378,00
Denne funksjonen krever at man er logget inn. Opprett en bruker og liste systemet for å holde styr på fremtidige kjøp eller ønskelister.
Opprett bruker
Login
Opprett bruker
Login
Send på mail
The 12th Gen Lapping Tool was specially developed for the Intel 12th Gen Contact Frame and simplifies the grinding/lapping of the CPU. The CPU is mounted on the tool with the contact frame and the final position of the CPU is simulated. Enclosed is sandpaper with 400, 1200 and 2,500 grit.
The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.
This allows the heatspreader (IHS) of the CPU to be ground, or lapped, in the state in which it will be operated. If you were to grind the CPU by hand, the contact pressure during installation in the socket would cause the IHS to bulge again.
As with the Intel 12th Gen Contact Frame, experienced overclockers were also involved in the development of the lapping tool. In addition to Roman "der8auer" Hartung, Allen "Splave" Golibersuch was involved in the design process. Allen was able to achieve two world records with the help of the combination of Contact Frame and the grinding of the CPU with the Lapping Tool.
The tolerances of the lapping tool allow the heatspreader to be ground down by 0.2 millimetres before the acrylic glass of the lapping tool is removed. If the acryic is being lapped down, stopp grinding immediately. This tolerance was deliberately chosen to prevent too much material from being removed from the IHS and to avoid damaging the contact frame.
It is recommended to grind off the heatspreader by a maximum of 40-150µm. It should be noted that grinding the CPU will void the . For the largest possible contact area between the IHS and the base plate of the CPU cooler, the latter should also be ground.
The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.
This allows the heatspreader (IHS) of the CPU to be ground, or lapped, in the state in which it will be operated. If you were to grind the CPU by hand, the contact pressure during installation in the socket would cause the IHS to bulge again.
As with the Intel 12th Gen Contact Frame, experienced overclockers were also involved in the development of the lapping tool. In addition to Roman "der8auer" Hartung, Allen "Splave" Golibersuch was involved in the design process. Allen was able to achieve two world records with the help of the combination of Contact Frame and the grinding of the CPU with the Lapping Tool.
The tolerances of the lapping tool allow the heatspreader to be ground down by 0.2 millimetres before the acrylic glass of the lapping tool is removed. If the acryic is being lapped down, stopp grinding immediately. This tolerance was deliberately chosen to prevent too much material from being removed from the IHS and to avoid damaging the contact frame.
It is recommended to grind off the heatspreader by a maximum of 40-150µm. It should be noted that grinding the CPU will void the . For the largest possible contact area between the IHS and the base plate of the CPU cooler, the latter should also be ground.