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SK Hynix HMA81GR7CJR8N-XN, 8 GB, 1 x 8 GB, DDR4, 288-pinners DIMM
Varenr.: [26129121] | Producent: Hynix | Model-nr.: HMA81GR7CJR8N-XN | EAN: 5715063745618
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High Density Module
SK hynix develops high-density (128/256GB) RDIMM and LRDIMM modules specialized to process Big Data. Our 256GB RDIMM and LRDIMM based on the 1ynm 16Gb DDR4 support stable data transfers with speeds of 3,200Mbps at 10W, the industry's lowest power budget.
Targeting In-memory Computing
Beyond RDIMM/LRDIMM modules with basic capacities for general applications, SK hynix’s High Density Modules deliver faster processing and larger memory needed for in-memory database, cache, and real-time big data analysis.
Our offerings include the 128GB RDIMM/LRDIMM based on 1xnm 16Gb DDR4 technology, now followed by the 256GB RDIMM/LRDIMM that doubles the density with next-generation 1ynm 16Gb DDR4.
3DS 4Hi Technology
Instead of conventional wire bonding, 3DS TSV (Through Silicon Via) technology is used to vertically interconnect the DRAM die, reducing module package height while boosting data transfer speeds.
Industry's Lowest Power Consumption
Our 256GB DDR4 RDIMM consumes around 8.5W of power and LRDIMM around 10.5W, both the most competitive levels in the High Density Module market.
SK hynix develops high-density (128/256GB) RDIMM and LRDIMM modules specialized to process Big Data. Our 256GB RDIMM and LRDIMM based on the 1ynm 16Gb DDR4 support stable data transfers with speeds of 3,200Mbps at 10W, the industry's lowest power budget.
Targeting In-memory Computing
Beyond RDIMM/LRDIMM modules with basic capacities for general applications, SK hynix’s High Density Modules deliver faster processing and larger memory needed for in-memory database, cache, and real-time big data analysis.
Our offerings include the 128GB RDIMM/LRDIMM based on 1xnm 16Gb DDR4 technology, now followed by the 256GB RDIMM/LRDIMM that doubles the density with next-generation 1ynm 16Gb DDR4.
3DS 4Hi Technology
Instead of conventional wire bonding, 3DS TSV (Through Silicon Via) technology is used to vertically interconnect the DRAM die, reducing module package height while boosting data transfer speeds.
Industry's Lowest Power Consumption
Our 256GB DDR4 RDIMM consumes around 8.5W of power and LRDIMM around 10.5W, both the most competitive levels in the High Density Module market.